[Pix-icfo-management] SEMICON Europa 2026 – Exhibitor Guide and September Coordination Meeting
Sabine Runge
Sabine.Runge at icfo.eu
Mon Sep 28 18:55:20 CEST 2026
Yes, for SEMICON all under control
Enviado desde Outlook para Android<https://aka.ms/AAb9ysg>
________________________________
From: Valerio Pruneri <Valerio.Pruneri at icfo.eu>
Sent: Monday, 28 September 2026 18:50:21
To: Sabine Runge <Sabine.Runge at icfo.eu>
Cc: pix-icfo-management at lists.icfo.es <pix-icfo-management at lists.icfo.es>
Subject: FW: SEMICON Europa 2026 – Exhibitor Guide and September Coordination Meeting
Sabine
The list was long….did you get this?
From: NOWAK Anna-Zuzanna (Chips JU) <Anna-Zuzanna.Nowak at chips-ju.europa.eu>
Sent: 28 September 2026 12:50
To: Valerio Pruneri <Valerio.Pruneri at icfo.eu>; Romano Hoofman (imec) <romano.hoofman at imec.be>; Annouck.Vanrompay at imec.be; anne.vandenbosch <anne.vandenbosch at imec.be>;
Subject: Re: SEMICON Europa 2026 – Exhibitor Guide and September Coordination Meeting
CAUTION: This email originated from outside the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe.
Dear all,
Hope you’re all well.
Following our recent coordination meeting, I have prepared an updated version of the SEMICON 2026 Exhibitor Guide, which now includes the delivery and shipping arrangements.
You will also find a Doodle poll<https://urldefense.com/v3/__https:/doodle.com/group-poll/participate/ejBQgnye/vote__;!!D9dNQwwGXtA!THhaDLKPTQjH0Yng67xu-uRYJQSmbmuwVXrBZWvbZMdGWcZGQLzvktGiaJevy0y_HUANTW8tq2U_sEjhLXtAz87HqrW--BjhzhqXZl_RLg$> for our second operational meeting in October. We would appreciate it if you could indicate your availability at your earliest convenience.
Please note that the stand mock-up included in the guide is not the final version. We are currently awaiting a revised iteration from the stand designer. The current version should therefore be considered a working draft intended to illustrate the overall concept and layout of the stand.
Should you have any additional questions, do not hesitate to reach out.
Kind regards,
Anna
[A blue and yellow logo Description automatically generated]
Anna Nowak
Communication Officer
Chips Joint Undertaking
M: +32 (0)499528748<tel:+32499528748>
Follow us on LinkedIn<https://urldefense.com/v3/__https:/be.linkedin.com/company/chips-ju__;!!D9dNQwwGXtA!THhaDLKPTQjH0Yng67xu-uRYJQSmbmuwVXrBZWvbZMdGWcZGQLzvktGiaJevy0y_HUANTW8tq2U_sEjhLXtAz87HqrW--BjhzhpRr7huBA$>
Sign up to the Chips JU newsletter<https://urldefense.com/v3/__https:/www.chips-ju.europa.eu/Subscribers/__;!!D9dNQwwGXtA!THhaDLKPTQjH0Yng67xu-uRYJQSmbmuwVXrBZWvbZMdGWcZGQLzvktGiaJevy0y_HUANTW8tq2U_sEjhLXtAz87HqrW--BjhzhoruAe7kg$>
[signature_2429989681]<https://urldefense.com/v3/__https:/efecs.eu/__;!!D9dNQwwGXtA!THhaDLKPTQjH0Yng67xu-uRYJQSmbmuwVXrBZWvbZMdGWcZGQLzvktGiaJevy0y_HUANTW8tq2U_sEjhLXtAz87HqrW--BjhzhpVHQP17g$>
From: NOWAK Anna-Zuzanna (Chips JU) <Anna-Zuzanna.Nowak at chips-ju.europa.eu<mailto:Anna-Zuzanna.Nowak at chips-ju.europa.eu>>
Date: Friday, 4 September 2026 at 11:37
To: Valerio Pruneri <Valerio.Pruneri at icfo.eu<mailto:Valerio.Pruneri at icfo.eu>>, Romano Hoofman (imec) <romano.hoofman at imec.be<mailto:romano.hoofman at imec.be>>, Annouck.Vanrompay at imec.be<mailto:Annouck.Vanrompay at imec.be> <Annouck.Vanrompay at imec.be<mailto:Annouck.Vanrompay at imec.be>>, Anne VAN DEN BOSCH <Anne.VandenBosch at imec.be<mailto:Anne.VandenBosch at imec.be>>, Katrien.Marent at imec.be<mailto:Katrien.Marent at imec.be> <Katrien.Marent at imec.be<mailto:Katrien.Marent at imec.be>>, jean-rene.lequepeys <jean-rene.lequepeys at cea.fr<mailto:jean-rene.lequepeys at cea.fr>>, dominique.noguet at cea.fr<mailto:dominique.noguet at cea.fr> <dominique.noguet at cea.fr<mailto:dominique.noguet at cea.fr>>, Bruno.PAING at cea.fr<mailto:Bruno.PAING at cea.fr> <Bruno.PAING at cea.fr<mailto:Bruno.PAING at cea.fr>>, pascale.caulier at grenoble-inp.fr<mailto:pascale.caulier at grenoble-inp.fr> <pascale.caulier at grenoble-inp.fr<mailto:pascale.caulier at grenoble-inp.fr>>, mathilde.betend at grenoble-inp.fr<mailto:mathilde.betend at grenoble-inp.fr> <mathilde.betend at grenoble-inp.fr<mailto:mathilde.betend at grenoble-inp.fr>>, Konstanze.Scheurer at mikroelektronik.fraunhofer.de<mailto:Konstanze.Scheurer at mikroelektronik.fraunhofer.de> <Konstanze.Scheurer at mikroelektronik.fraunhofer.de<mailto:Konstanze.Scheurer at mikroelektronik.fraunhofer.de>>, Stephan.Guttowski at mikroelektronik.fraunhofer.de<mailto:Stephan.Guttowski at mikroelektronik.fraunhofer.de> <Stephan.Guttowski at mikroelektronik.fraunhofer.de<mailto:Stephan.Guttowski at mikroelektronik.fraunhofer.de>>, Patrick BRESSLER <patrick.bressler at mikroelektronik.fraunhofer.de<mailto:patrick.bressler at mikroelektronik.fraunhofer.de>>, romy.zschiedrich at mikroelektronik.fraunhofer.de<mailto:romy.zschiedrich at mikroelektronik.fraunhofer.de> <romy.zschiedrich at mikroelektronik.fraunhofer.de<mailto:romy.zschiedrich at mikroelektronik.fraunhofer.de>>, Enrico Sangiorgi <enrico.sangiorgi at unibo.it<mailto:enrico.sangiorgi at unibo.it>>, stefano.fabris at cnr.it<mailto:stefano.fabris at cnr.it> <stefano.fabris at cnr.it<mailto:stefano.fabris at cnr.it>>, Roberto ZAFALON <roberto.zafalon at st.com<mailto:roberto.zafalon at st.com>>, francesco.lavia at cnr.it<mailto:francesco.lavia at cnr.it> <francesco.lavia at cnr.it<mailto:francesco.lavia at cnr.it>>, Caroline Bedran <bedran at aeneas-office.org<mailto:bedran at aeneas-office.org>>, Elisabeth STEIMETZ <elisabeth.steimetz at vdivde-it.de<mailto:elisabeth.steimetz at vdivde-it.de>>, Paolo Azzoni <paolo.azzoni at inside-association.eu<mailto:paolo.azzoni at inside-association.eu>>, hamelin at blumorpho.com<mailto:hamelin at blumorpho.com> <hamelin at blumorpho.com<mailto:hamelin at blumorpho.com>>, marina.dias at inl.int<mailto:marina.dias at inl.int> <marina.dias at inl.int<mailto:marina.dias at inl.int>>, inge.asselberghs at imec.be<mailto:inge.asselberghs at imec.be> <inge.asselberghs at imec.be<mailto:inge.asselberghs at imec.be>>, Alexandra.Houben at imec.be<mailto:Alexandra.Houben at imec.be> <Alexandra.Houben at imec.be<mailto:Alexandra.Houben at imec.be>>, linda.wetzel at imec.be<mailto:linda.wetzel at imec.be> <Linda.Wetzel at imec.be<mailto:Linda.Wetzel at imec.be>>, projects at silicon-saxony.de<mailto:projects at silicon-saxony.de> <projects at silicon-saxony.de<mailto:projects at silicon-saxony.de>>, alesia.laessig at silicon-saxony.de<mailto:alesia.laessig at silicon-saxony.de> <alesia.laessig at silicon-saxony.de<mailto:alesia.laessig at silicon-saxony.de>>, francine.papillon at cea.fr<mailto:francine.papillon at cea.fr> <francine.papillon at cea.fr<mailto:francine.papillon at cea.fr>>, tamara.gruber at mikroelektronik.fraunhofer.de<mailto:tamara.gruber at mikroelektronik.fraunhofer.de> <tamara.gruber at mikroelektronik.fraunhofer.de<mailto:tamara.gruber at mikroelektronik.fraunhofer.de>>
Cc: CHICHKOV Anton (Chips JU) <Anton.Chichkov at chips-ju.europa.eu<mailto:Anton.Chichkov at chips-ju.europa.eu>>, FERRER LLOSA Berta (Chips JU) <Berta.FerrerLlosa at chips-ju.europa.eu<mailto:Berta.FerrerLlosa at chips-ju.europa.eu>>, GAUDIO Luciano (Chips JU) <Luciano.Gaudio at chips-ju.europa.eu<mailto:Luciano.Gaudio at chips-ju.europa.eu>>, DE LESSINES Laurence (Chips JU) <Laurence.DeLessines at chips-ju.europa.eu<mailto:Laurence.DeLessines at chips-ju.europa.eu>>, MARTINS Andreia (Chips JU) <Andreia.MARTINS at chips-ju.europa.eu<mailto:Andreia.MARTINS at chips-ju.europa.eu>>, PEGLIDOU Vasiliki (CHIPS JU) <Vasiliki.PEGLIDOU-ext at chips-ju.europa.eu<mailto:Vasiliki.PEGLIDOU-ext at chips-ju.europa.eu>>, DEMORAT Oksana <operation at aeneas-office.org<mailto:operation at aeneas-office.org>>, Metzner, Sarah <sarah.metzner at vdivde-it.de<mailto:sarah.metzner at vdivde-it.de>>, Heidi Teunissen <heidi.teunissen at inside-association.eu<mailto:heidi.teunissen at inside-association.eu>>, lemeau at aeneas-office.org<mailto:lemeau at aeneas-office.org> <lemeau at aeneas-office.org<mailto:lemeau at aeneas-office.org>>, Maha Karim-Hosselet <maha.karim-hosselet at inside-association.eu<mailto:maha.karim-hosselet at inside-association.eu>>, isabella.preuer at silicon-austria.com<mailto:isabella.preuer at silicon-austria.com> <isabella.preuer at silicon-austria.com<mailto:isabella.preuer at silicon-austria.com>>, ines.costa at inl.int<mailto:ines.costa at inl.int> <ines.costa at inl.int<mailto:ines.costa at inl.int>>, elina.mielityinen at tuni.fi<mailto:elina.mielityinen at tuni.fi> <elina.mielityinen at tuni.fi<mailto:elina.mielityinen at tuni.fi>>, eda.cig at silicon-saxony.de<mailto:eda.cig at silicon-saxony.de> <eda.cig at silicon-saxony.de<mailto:eda.cig at silicon-saxony.de>>, Sabine.Runge at icfo.eu<mailto:Sabine.Runge at icfo.eu> <Sabine.Runge at icfo.eu<mailto:Sabine.Runge at icfo.eu>>
Subject: Re: SEMICON Europa 2026 – Exhibitor Guide and September Coordination Meeting
Dear all,
Hope you all enjoyed your summer break.
Based on the responses received, our SEMICON Europa 2026 Exhibitor Coordination Meeting will take place on:
?? Wednesday, 16 September 2026
?? 11:00 – 12:00 CEST
??Teams link: SEMICON 2026 - Operational meeting | Meeting-Join | Microsoft Teams<https://teams.microsoft.com/meet/320476097919201?p=CMNOX9VX9iTFQn0grR>
The meeting will focus on the practical preparations for our joint presence at the Chips JU stand, including:
* exhibitor setup and logistics,
* promotional and visual materials,
* staffing arrangements,
* access and travel information,
* final deadlines and next steps.
If you cannot participate, don’t worry – we will soon send out a doodle for a follow up meeting.
Kind regards,
Anna
[A blue and yellow logo Description automatically generated]
Anna Nowak
Communication Officer
Chips Joint Undertaking
M: +32 (0)499528748<tel:+32499528748>
From: NOWAK Anna-Zuzanna (Chips JU) <Anna-Zuzanna.Nowak at chips-ju.europa.eu<mailto:Anna-Zuzanna.Nowak at chips-ju.europa.eu>>
Date: Monday, 20 July 2026 at 10:49
To: Valerio Pruneri <valerio.pruneri at icfo.eu<mailto:valerio.pruneri at icfo.eu>>, Romano Hoofman (imec) <romano.hoofman at imec.be<mailto:romano.hoofman at imec.be>>, Annouck.Vanrompay at imec.be<mailto:Annouck.Vanrompay at imec.be> <Annouck.Vanrompay at imec.be<mailto:Annouck.Vanrompay at imec.be>>, Anne VAN DEN BOSCH <Anne.VandenBosch at imec.be<mailto:Anne.VandenBosch at imec.be>>, Katrien.Marent at imec.be<mailto:Katrien.Marent at imec.be> <Katrien.Marent at imec.be<mailto:Katrien.Marent at imec.be>>, jean-rene.lequepeys <jean-rene.lequepeys at cea.fr<mailto:jean-rene.lequepeys at cea.fr>>, dominique.noguet at cea.fr<mailto:dominique.noguet at cea.fr> <dominique.noguet at cea.fr<mailto:dominique.noguet at cea.fr>>, Bruno.PAING at cea.fr<mailto:Bruno.PAING at cea.fr> <Bruno.PAING at cea.fr<mailto:Bruno.PAING at cea.fr>>, pascale.caulier at grenoble-inp.fr<mailto:pascale.caulier at grenoble-inp.fr> <pascale.caulier at grenoble-inp.fr<mailto:pascale.caulier at grenoble-inp.fr>>, mathilde.betend at grenoble-inp.fr<mailto:mathilde.betend at grenoble-inp.fr> <mathilde.betend at grenoble-inp.fr<mailto:mathilde.betend at grenoble-inp.fr>>, Konstanze.Scheurer at mikroelektronik.fraunhofer.de<mailto:Konstanze.Scheurer at mikroelektronik.fraunhofer.de> <Konstanze.Scheurer at mikroelektronik.fraunhofer.de<mailto:Konstanze.Scheurer at mikroelektronik.fraunhofer.de>>, Stephan.Guttowski at mikroelektronik.fraunhofer.de<mailto:Stephan.Guttowski at mikroelektronik.fraunhofer.de> <Stephan.Guttowski at mikroelektronik.fraunhofer.de<mailto:Stephan.Guttowski at mikroelektronik.fraunhofer.de>>, Patrick BRESSLER <patrick.bressler at mikroelektronik.fraunhofer.de<mailto:patrick.bressler at mikroelektronik.fraunhofer.de>>, romy.zschiedrich at mikroelektronik.fraunhofer.de<mailto:romy.zschiedrich at mikroelektronik.fraunhofer.de> <romy.zschiedrich at mikroelektronik.fraunhofer.de<mailto:romy.zschiedrich at mikroelektronik.fraunhofer.de>>, Enrico Sangiorgi <enrico.sangiorgi at unibo.it<mailto:enrico.sangiorgi at unibo.it>>, stefano.fabris at cnr.it<mailto:stefano.fabris at cnr.it> <stefano.fabris at cnr.it<mailto:stefano.fabris at cnr.it>>, Roberto ZAFALON <roberto.zafalon at st.com<mailto:roberto.zafalon at st.com>>, francesco.lavia at cnr.it<mailto:francesco.lavia at cnr.it> <francesco.lavia at cnr.it<mailto:francesco.lavia at cnr.it>>, Caroline Bedran <bedran at aeneas-office.org<mailto:bedran at aeneas-office.org>>, Elisabeth STEIMETZ <elisabeth.steimetz at vdivde-it.de<mailto:elisabeth.steimetz at vdivde-it.de>>, Paolo Azzoni <paolo.azzoni at inside-association.eu<mailto:paolo.azzoni at inside-association.eu>>, hamelin at blumorpho.com<mailto:hamelin at blumorpho.com> <hamelin at blumorpho.com<mailto:hamelin at blumorpho.com>>, marina.dias at inl.int<mailto:marina.dias at inl.int> <marina.dias at inl.int<mailto:marina.dias at inl.int>>, inge.asselberghs at imec.be<mailto:inge.asselberghs at imec.be> <inge.asselberghs at imec.be<mailto:inge.asselberghs at imec.be>>, Alexandra.Houben at imec.be<mailto:Alexandra.Houben at imec.be> <Alexandra.Houben at imec.be<mailto:Alexandra.Houben at imec.be>>, linda.wetzel at imec.be<mailto:linda.wetzel at imec.be> <linda.wetzel at imec.be<mailto:linda.wetzel at imec.be>>, projects at silicon-saxony.de<mailto:projects at silicon-saxony.de> <projects at silicon-saxony.de<mailto:projects at silicon-saxony.de>>, alesia.laessig at silicon-saxony.de<mailto:alesia.laessig at silicon-saxony.de> <alesia.laessig at silicon-saxony.de<mailto:alesia.laessig at silicon-saxony.de>>, francine.papillon at cea.fr<mailto:francine.papillon at cea.fr> <francine.papillon at cea.fr<mailto:francine.papillon at cea.fr>>, tamara.gruber at mikroelektronik.fraunhofer.de<mailto:tamara.gruber at mikroelektronik.fraunhofer.de> <tamara.gruber at mikroelektronik.fraunhofer.de<mailto:tamara.gruber at mikroelektronik.fraunhofer.de>>
Cc: CHICHKOV Anton (Chips JU) <Anton.Chichkov at chips-ju.europa.eu<mailto:Anton.Chichkov at chips-ju.europa.eu>>, FERRER LLOSA Berta (Chips JU) <Berta.FerrerLlosa at chips-ju.europa.eu<mailto:Berta.FerrerLlosa at chips-ju.europa.eu>>, GAUDIO Luciano (Chips JU) <Luciano.Gaudio at chips-ju.europa.eu<mailto:Luciano.Gaudio at chips-ju.europa.eu>>, DE LESSINES Laurence (Chips JU) <Laurence.DeLessines at chips-ju.europa.eu<mailto:Laurence.DeLessines at chips-ju.europa.eu>>, MARTINS Andreia (Chips JU) <Andreia.MARTINS at chips-ju.europa.eu<mailto:Andreia.MARTINS at chips-ju.europa.eu>>, PEGLIDOU Vasiliki (CHIPS JU) <Vasiliki.PEGLIDOU-ext at chips-ju.europa.eu<mailto:Vasiliki.PEGLIDOU-ext at chips-ju.europa.eu>>, DEMORAT Oksana <operation at aeneas-office.org<mailto:operation at aeneas-office.org>>, Metzner, Sarah <sarah.metzner at vdivde-it.de<mailto:sarah.metzner at vdivde-it.de>>, Heidi Teunissen <heidi.teunissen at inside-association.eu<mailto:heidi.teunissen at inside-association.eu>>, lemeau at aeneas-office.org<mailto:lemeau at aeneas-office.org> <lemeau at aeneas-office.org<mailto:lemeau at aeneas-office.org>>, Maha Karim-Hosselet <maha.karim-hosselet at inside-association.eu<mailto:maha.karim-hosselet at inside-association.eu>>, isabella.preuer at silicon-austria.com<mailto:isabella.preuer at silicon-austria.com> <isabella.preuer at silicon-austria.com<mailto:isabella.preuer at silicon-austria.com>>, ines.costa at inl.int<mailto:ines.costa at inl.int> <ines.costa at inl.int<mailto:ines.costa at inl.int>>, elina.mielityinen at tuni.fi<mailto:elina.mielityinen at tuni.fi> <elina.mielityinen at tuni.fi<mailto:elina.mielityinen at tuni.fi>>, eda.cig at silicon-saxony.de<mailto:eda.cig at silicon-saxony.de> <eda.cig at silicon-saxony.de<mailto:eda.cig at silicon-saxony.de>>, Sabine.Runge at icfo.eu<mailto:Sabine.Runge at icfo.eu> <Sabine.Runge at icfo.eu<mailto:Sabine.Runge at icfo.eu>>
Subject: SEMICON Europa 2026 – Exhibitor Guide and September Coordination Meeting
Dear all,
Hope you’re all well! Please find attached the SEMICON 2026 - Chips JU Stand Exhibitor Guide. The guide consolidates the practical information currently available regarding our joint presence at the Chips JU stand during SEMICON Europa 2026 in November and should help you prepare everything you need well in advance, so you can enjoy the rest of your summer a little more relaxed ??
The guide includes information on:
* your individual setup,
* logo and slogan requirements,
* video and promotional materials,
* staffing expectations,
* travel and access arrangements,
* contact points and next steps.
As specified in the guide, we kindly ask participating entities to provide their latest logo (preferably in AI or SVG format), their slogan/tagline, as soon as possible, ideally by the end of July 2026.
Please also note that an operational coordination meeting will be organised in September. To help us find the most suitable date and time, please complete the Doodle poll: https://doodle.com/group-poll/participate/bWK5n5Jb<https://urldefense.com/v3/__https:/doodle.com/group-poll/participate/bWK5n5Jb__;!!D9dNQwwGXtA!THhaDLKPTQjH0Yng67xu-uRYJQSmbmuwVXrBZWvbZMdGWcZGQLzvktGiaJevy0y_HUANTW8tq2U_sEjhLXtAz87HqrW--BjhzhqhD5m9Xg$>
Should you have any questions in the meantime, please do not hesitate to contact us.
Kind regards,
Anna
[A blue and yellow logo Description automatically generated]
Anna Nowak
Communication Officer
Chips Joint Undertaking
M: +32 (0)499528748<tel:+32499528748>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://lists.icfo.es/pipermail/pix-icfo-management/attachments/20260928/604978ee/attachment-0001.htm>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image001.png
Type: image/png
Size: 31039 bytes
Desc: image001.png
URL: <http://lists.icfo.es/pipermail/pix-icfo-management/attachments/20260928/604978ee/attachment-0002.png>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image003.png
Type: image/png
Size: 37311 bytes
Desc: image003.png
URL: <http://lists.icfo.es/pipermail/pix-icfo-management/attachments/20260928/604978ee/attachment-0003.png>
More information about the Pix-icfo-management
mailing list