[Pixeurope-wp7] PIXEurope - WP7 Packaging - Kick-off Meeting (Tuesday 16 Sept, 11:00 CET / 10:00 Irish Time)

[Padraic Morrissey]

Dear WP7 partners,

Our first WP7 Packaging meeting will take place on Tuesday 16th September at 11:00 Brussels time (10:00 Irish time). If you have not received the calendar invite, please let us know.
For this first session, we ask each partner to bring one slide that covers:


  *   A short introduction to your organisation/role.
  *   Your main objectives in WP7 Packaging.
  *   Two or three actions you expect to work on during Q4 2025.

We know that much of the packaging work will become technically active later in the project once equipment is installed. However, packaging connects with several other WPs (Design, Test and Reliability, Monolithic PICs, Hybrid Integration), so it is important that we begin planning now.

At the meeting, Tyndall will give a high-level overview of WP7, and we will look together at how each partner fits into the different tasks. This will not be an overly technical session. The aim is to get everyone aligned and create a base that we can build on in the months ahead.

Please send your slide to me by the end of Monday 15th September. Apologies for the short notice.

For context, here is a quick reminder of the roles from the proposal:


  *   TNI (Lead): Overall responsibility; package and wafer-level processes; EIC reference chips; demonstrators; transfer to manufacturing.
  *   ICFO: Electro-optical interposers, micro-optics; prototype validation.
  *   UC3M: Multiphysics models, simulation optimisation, high-density RF interconnect design.
  *   TU/e: Collect design rules, formalise into ADKs, ensure simulation-design flow compatibility.
  *   VTT: Fabrication of PIC reference chips (Si, SiN, InP).
  *   UVIGO: Novel packages via 3D printing and advanced materials (LCP, PEEK, ceramics).
  *   IMEC: High-precision die-to-wafer flip-chip processes in iSiPP300 platform.

Thank you in advance for preparing your contributions. We look forward to the discussion next week.

Kind regards,
Padraic



Padraic Morrissey
Senior Technology Programme Manager
Photonics Packaging and Systems Integration Group | Tyndall National Institute

Phone: (+353) 021-234 6106
Email: padraic.morrissey at tyndall.ie<mailto:padraic.morrissey at tyndall.ie>
LinkedIn: www.linkedin.com/in/padraicm<http://www.linkedin.com/in/padraicm>

www.tyndall.ie <http://www.tyndall.ie >  |  Lee Maltings, Dyke Parade, Cork, Ireland. T12 R5CP

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