[Pixeurope-wp5] PIXEurope - Reference PICs – Platform Contact for Follow-Up

[Padraic Morrissey]

Dear WP5 Parters,

Following the recent WP5 discussion on reference PICs, we are now moving forward with the next agreed steps. These reference PICs will serve as simple, non-application-specific test vehicles that enable early work on packaging, interfaces, and testing, while helping to align design, fabrication, and packaging activities across WP4, WP5, and WP7.

As a first step, could you let us know who would be the most appropriate technical contact for reference PIC discussions within your organisation for the platform(s) you are involved in? This would typically be someone familiar with platform capabilities, interfaces, and fabrication planning.

For context, the current platform–partner groupings we are working from are:


  *   InP (TNO)
  *   Thin SOI (IMEC, UGENT)
  *   Thick SOI (VTT)
  *   SiN (UTWENTE, CSIC, CEA-LETI)
  *   SiC (FBK)
  *   Ge-on-Si (WUT)
  *   Al₂O₃ (UTWENTE)

This list is a first draft for orientation only and may need refinement.

At this stage, we are not asking for any technical input yet. Once the contact points are identified, we will follow up directly to schedule short one-to-one discussions to walk through scope, timelines, and constraints for each platform.

If possible, it would be helpful to have a name and contact details by close of business on Tuesday 27th January. You can see this information to me at padraic.morrissey at tyndall.ie<mailto:padraic.morrissey at tyndall.ie>.

Thanks everyone.

Kind regards,
Padraic



Padraic Morrissey
Senior Technology Programme Manager
Photonics Packaging and System Integration Group | Tyndall National Institute

Phone: (+353) 021-234 6106
Email: padraic.morrissey at tyndall.ie<mailto:padraic.morrissey at tyndall.ie>
LinkedIn: www.linkedin.com/in/padraicm<http://www.linkedin.com/in/padraicm>

www.tyndall.ie <http://www.tyndall.ie >  |  Lee Maltings, Dyke Parade, Cork, Ireland. T12 R5CP

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