[Pixeurope-mct] PIXEurope in round tables and events

[Valerio Pruneri]

Hi Marina
Agree for general purposes!
But in the case of Optica they ask for some specific statements on what we do not do.
Will consider your comment though.

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________________________________
From: Marina Santana <Marina.Santana at icfo.eu>
Sent: Monday, October 6, 2025 9:44:11 am
To: Valerio Pruneri <Valerio.Pruneri at icfo.eu>; pixeurope-mct at lists.icfo.es <pixeurope-mct at lists.icfo.es>
Subject: RE: PIXEurope in round tables and events

Hi Valerio,

I think the overall information and tone are spot on.

My only comment would be on emphasising the scope of the pilot line and avoid the negative phrasing:

Instead of “It will be making prototyping but not volume production” I would say something like “The pilot line aims to bridge the gap between research and industrial manufacturing by accelerating prototyping and technology validation, preparing key PIC technologies for future volume production.”

BR,
Marina


From: Pixeurope-mct <pixeurope-mct-bounces at lists.icfo.es> On Behalf Of Valerio Pruneri via Pixeurope-mct
Sent: 05 October 2025 6:09 PM
To: pixeurope-mct at lists.icfo.es
Subject: [Pixeurope-mct] PIXEurope in round tables and events

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Hi All
I share below some thoughts that can be used in future events. I have written them and still have to revise, so they are only for your eye. Note that there are repetitions but these help address different points or questions.
Any suggestion – don’t look at language as I will speak – is welcome.
Please do not circulate them outside this group.
Cheers,
Valerio

Broad aim and objectives
PIXEurope is a Chips JU Pilot Line aiming at developing and offering the next generation of photonic integrated circuit (PIC) technology.
It covers a wide range of material platforms and their integration, from design to chip fabrication, packaging and testing, and will create a unique open access for End-users that want to accelerate and increase the technology and manufacturing readiness levels.
PIXEurope aims at transferring the PIC technologies and processes to manufacturers. It will be making prototyping but not volume production. It will also offer training of high skilled personnel.
PIXEurope will also work closely with end-users through collaborative projects. This is actually the first Open Access activity that we foresee.
End users that approached PIXEurope range from designers that also use AI tools, to suppliers of semiconductor equipment that want to adapt their offering to photonics, front-end and back-end manufacturers that are interesting in stabilizing new processes and, last but not least, vertical integrators that need to accelerate their product developments.

process stability and design-packaging-test
There are already PDKs offered for different material platforms, from Si to SiN, III-V and lithium niobate. PIXEurope aims at stabilizing technologies and processes and release PDKs on advanced platforms, especially those integrated different materials, such as TFLN, quantum dots, and 2-D materials.
Not only chips but also packaging and testing design kits. For example, electro-optic interposer technology for co-packaged optics. Here collaboration with other pilot lines, such as APECs, more focused on EIC integration will be essential.
PIXEurope also will train a new generation of scientists and engineers for developing the technologies, transferring them and making products at end-user premises.

VCs and de-risks
In most cases, small and medium enterprises, such as spin-off and start-ups, do not have enough volume to engage manufacturers, the so called “manufacturing gap”. These SMEs do not also have infrastructure capabilities required to accelerate their products. By working with PIXEurope they will accelerate the product development to the level needed to access larger foundries and receive the required related larger VC investments.

Resources & speed
In PIXEurope we make use of more efficient materials and design to increase energy efficiency, for example Telecom and AI data centre. We investigate also materials whose composition is safe for the environment, for example lead free quantum dots. We also aim at scaling the technologies to process at wafer level that would imply higher production speed, lower power and water consumption.

Scaling
PIXEurope aims to demonstrate scalability transfer processes and technologies. It does not scale and produce large volumes. We expect that manufacturers in Europe will scale PIXEurope’s technologies. Several exist in the chip area and others are getting stronger in the packaging, assembly and testing. WE are defining IP and cost models to favor the technology transfer from PIXEurope to end-users, including manufacturers, that allow scaling to production while still maintaining the possibility to develop technologies further inside the Pilot Line infrastructure.

first entry point
PIXEurope has a direct an entry point through its gateway that collects requests from end-users and distributes them among the Pilot Line’s partners better suited to meet them. Chips JU Design platform and National Competence Centers will also be key to manage the demand from end-users among the Pilot Lines, National and Regional semiconductor facilities.

One tech transfer milestone

In addition to stabilizing traditional PIC platforms, PIXEurope will also deliver Process, Packaging and Testing Design Kits on new hybrid platforms such as colloidal quantum dots and 2-D materials on silicon photonics and electro-optic interposers for co-packaged optics.


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