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<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos",sans-serif">Hi Valerio,
<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos",sans-serif"><br>
I think the overall information and tone are spot on. <o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos",sans-serif"><br>
My only comment would be on emphasising the scope of the pilot line and avoid the negative phrasing:<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos",sans-serif"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif">Instead of “</span><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif;color:#0070C0">It will be making prototyping but not volume production”
</span><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif;color:black">I would say something like
</span><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif;color:#0070C0">“The pilot line aims to bridge the gap between research and industrial manufacturing by accelerating prototyping and technology validation, preparing key PIC technologies
for future volume production.”<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif;color:#0070C0"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif;color:black">BR,
<br>
Marina</span><span style="font-size:12.0pt;font-family:"Aptos Display",sans-serif;color:black"><o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos",sans-serif"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt;font-family:"Aptos",sans-serif"><o:p> </o:p></span></p>
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<p class="MsoNormal"><b><span lang="EN-US" style="mso-fareast-language:EN-GB">From:</span></b><span lang="EN-US" style="mso-fareast-language:EN-GB"> Pixeurope-mct <pixeurope-mct-bounces@lists.icfo.es>
<b>On Behalf Of </b>Valerio Pruneri via Pixeurope-mct<br>
<b>Sent:</b> 05 October 2025 6:09 PM<br>
<b>To:</b> pixeurope-mct@lists.icfo.es<br>
<b>Subject:</b> [Pixeurope-mct] PIXEurope in round tables and events<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal" style="background:#FFEB9C"><b><span style="font-size:10.0pt;color:#9C6500;background:#FFEB9C;mso-fareast-language:EN-GB">CAUTION:</span></b><span style="font-size:10.0pt;color:black;background:#FFEB9C;mso-fareast-language:EN-GB"> This email
originated from outside the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe.</span><span style="font-size:12.0pt;font-family:"Aptos",sans-serif;mso-fareast-language:EN-GB"><o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US">Hi All<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">I share below some thoughts that can be used in future events. I have written them and still have to revise, so they are only for your eye. Note that there are repetitions but these help address different points or questions.<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Any suggestion – don’t look at language as I will speak – is welcome.<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Please do not circulate them outside this group.<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Cheers,<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Valerio<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><b><span lang="EN-US">Broad aim and objectives<o:p></o:p></span></b></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">PIXEurope is a Chips JU Pilot Line aiming at developing and offering the next generation of photonic integrated circuit (PIC) technology.
<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">It covers a wide range of material platforms and their integration, from design to chip fabrication, packaging and testing, and will create a unique open access for End-users that want to accelerate
and increase the technology and manufacturing readiness levels.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">PIXEurope aims at transferring the PIC technologies and processes to manufacturers. It will be making prototyping but not volume production. It will also offer training of high skilled personnel.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">PIXEurope will also work closely with end-users through collaborative projects. This is actually the first Open Access activity that we foresee.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">End users that approached PIXEurope range from designers that also use AI tools, to suppliers of semiconductor equipment that want to adapt their offering to photonics, front-end and back-end
manufacturers that are interesting in stabilizing new processes and, last but not least, vertical integrators that need to accelerate their product developments.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:12.0pt"><o:p> </o:p></span></p>
<p class="MsoNormal" style="margin-bottom:8.0pt;line-height:115%"><b>process stability</b> and
<b>design-packaging-test</b> <o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">There are already PDKs offered for different material platforms, from Si to SiN, III-V and lithium niobate. PIXEurope aims at stabilizing technologies and processes and release PDKs on advanced
platforms, especially those integrated different materials, such as TFLN, quantum dots, and 2-D materials.
<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">Not only chips but also packaging and testing design kits. For example, electro-optic interposer technology for co-packaged optics. Here collaboration with other pilot lines, such as APECs, more
focused on EIC integration will be essential.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">PIXEurope also will train a new generation of scientists and engineers for developing the technologies, transferring them and making products at end-user premises.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0"><o:p> </o:p></span></p>
<p class="MsoNormal" style="margin-bottom:8.0pt;line-height:115%"><b>VCs</b> and <b>
de-risks</b> <span style="font-size:12.0pt;line-height:115%"><o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">In most cases, small and medium enterprises, such as spin-off and start-ups, do not have enough volume to engage manufacturers, the so called “manufacturing gap”. These SMEs do not also have
infrastructure capabilities required to accelerate their products. By working with PIXEurope they will accelerate the product development to the level needed to access larger foundries and receive the required related larger VC investments.
<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0"><o:p> </o:p></span></p>
<p class="MsoNormal" style="margin-bottom:8.0pt;line-height:115%"><b>Resources & speed</b><o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">In PIXEurope we make use of more efficient materials and design to increase energy efficiency, for example Telecom and AI data centre. We investigate also materials whose composition is safe
for the environment, for example lead free quantum dots. We also aim at scaling the technologies to process at wafer level that would imply higher production speed, lower power and water consumption.<o:p></o:p></span></p>
<p class="MsoNormal" style="margin-bottom:8.0pt;line-height:115%"><b><o:p> </o:p></b></p>
<p class="MsoNormal" style="margin-bottom:8.0pt;line-height:115%"><b>Scaling</b><o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">PIXEurope aims to demonstrate scalability transfer processes and technologies. It does not scale and produce large volumes. We expect that manufacturers in Europe will scale PIXEurope’s technologies.
Several exist in the chip area and others are getting stronger in the packaging, assembly and testing. WE are defining IP and cost models to favor the technology transfer from PIXEurope to end-users, including manufacturers, that allow scaling to production
while still maintaining the possibility to develop technologies further inside the Pilot Line infrastructure.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0"><o:p> </o:p></span></p>
<p class="MsoNormal" style="margin-bottom:8.0pt;line-height:115%"><b>first entry point</b><o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">PIXEurope has a direct an entry point through its gateway that collects requests from end-users and distributes them among the Pilot Line’s partners better suited to meet them. Chips JU Design
platform and National Competence Centers will also be key to manage the demand from end-users among the Pilot Lines, National and Regional semiconductor facilities.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0"><o:p> </o:p></span></p>
<p class="MsoNormal">One <b>tech transfer</b> milestone<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><span style="font-size:16.0pt;color:#0070C0">In addition to stabilizing traditional PIC platforms, PIXEurope will also deliver Process, Packaging and Testing Design Kits on new hybrid platforms such as colloidal quantum dots and 2-D materials
on silicon photonics and electro-optic interposers for co-packaged optics.</span><o:p></o:p></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
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