<div dir="ltr"><div>dear Valerio,</div><div><span id="gmail-docs-internal-guid-4868dacb-7fff-d750-d08a-8353d04d3909"><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">In FBK, the key PIC technologies to be prioritized considering both interest from industrial and academic partners are described below mapping to the key-technologies from the chipsact2 slide you delivered. In summary, there is a lot of interest in expanding to the NIR/VIS region, in photonic electronic integration and advanced packaging. </span></p><br><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Key future application areas include:</span></p><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">New semiconductor technologies</span></p><ul style="margin-top:0px;margin-bottom:0px"><li dir="ltr" style="list-style-type:disc;font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline;white-space:pre"><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt" role="presentation"><span style="background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">3D Heterogenous integration and co-packaged Optics</span></p></li></ul><p dir="ltr" style="line-height:1.39;margin-left:36pt;margin-top:0pt;margin-bottom:8pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Heterogeneous integration of EPIC-ASIC chiplets for advanced imaging and few-photons detection in low energy sensing applications. Heterogeneous integration of MEMS and photonic technologies for resource and energy saving point of care diagnosis. </span></p><ul style="margin-top:0px;margin-bottom:0px"><li dir="ltr" style="list-style-type:disc;font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-style:italic;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline;white-space:pre"><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt" role="presentation"><span style="background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Optical and RF-links: </span><span style="background-color:transparent;font-weight:400;font-style:normal;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">FBK will develop PICs and optical components for short distance high-speed datalinks to replace more energy hungry electronic links.</span></p></li></ul><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Circuit and disruptive chip architecture </span></p><ul style="margin-top:0px;margin-bottom:0px"><li dir="ltr" style="list-style-type:disc;font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-style:italic;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline;white-space:pre"><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt" role="presentation"><span style="background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">New computing paradigms: </span><span style="background-color:transparent;font-weight:400;font-style:normal;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">FBK plans to develop photonic chips for quantum simulator systems working close to room temperature as alternatives to cryogenic quantum systems.</span></p></li></ul><br><ul style="margin-top:0px;margin-bottom:0px"><li dir="ltr" style="list-style-type:disc;font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline;white-space:pre"><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt" role="presentation"><span style="background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Dedicated and Versatile Accelerators: </span><span style="background-color:transparent;font-weight:400;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Smart photonic electronic chiplets based solutions for automotive applications (lidar) and Navigation systems (gyro, photonic -mems accelerometers) with increased performances and low energy consumption.</span></p></li></ul><br><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Systems Algorithms and EDA TOOLs</span></p><ul style="margin-top:0px;margin-bottom:0px"><li dir="ltr" style="list-style-type:disc;font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-style:italic;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline;white-space:pre"><p dir="ltr" style="line-height:1.39;margin-top:0pt;margin-bottom:8pt" role="presentation"><span style="background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Sustainable electronics and facility efficiency: </span><span style="background-color:transparent;font-weight:400;font-style:normal;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">Extend FBK technologies PDK coverage to be EDA TOOLs ready and allow for efficient photonic design, reducing design costs increasing overall yield and therefore saving fabrication costs and energy.</span></p></li></ul><br><p dir="ltr" style="line-height:1.39;margin-top:12pt;margin-bottom:12pt"><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">These areas represent high‑impact domains where European capabilities can be significantly strengthened through a dedicated effort on </span><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-weight:700;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">visible‑spectrum PIC technologies and advanced packaging</span><span style="font-family:Aptos;color:rgb(0,0,0);background-color:transparent;font-variant-numeric:normal;font-variant-east-asian:normal;font-variant-alternates:normal;vertical-align:baseline">, ensuring competitiveness, innovation capacity, and technological sovereignty.</span></p><br></span></div><div><span>Georg</span></div><div><span><br></span></div><div><br></div><div><div dir="ltr" class="gmail_signature" data-smartmail="gmail_signature"><div dir="ltr"><div><font face="courier new,monospace" size="2">******************************************************</font></div><div><font face="courier new,monospace" size="2">Dipl.Ing. Dr. Georg Pucker</font></div><div><font face="courier new,monospace" size="2">Senior Researcher / Head of Research unit</font></div><div><font face="courier new,monospace" size="2">Integrated and Quantum Optics (I&QO)</font></div><div><font face="courier new, monospace">Center</font><font face="courier new,monospace" size="2"> for Sensors and Devices (FBK-SD)</font></div><div><font face="courier new,monospace" size="2"> Bruno Kessler Foundation (FBK)</font></div><div><font face="courier new,monospace" size="2">Via Sommarive 18</font></div><div><font face="courier new,monospace" size="2">I-38123 Trento, Italy</font></div><div><font face="courier new,monospace" size="2">e-mail: <a href="mailto:pucker@fbk.eu" target="_blank">pucker@fbk.eu</a></font></div><div><font face="courier new,monospace" size="2">phone:+39 0461 314 429</font></div><div><font face="courier new,monospace" size="2"><img width="200" height="93" src="https://ci3.googleusercontent.com/mail-sig/AIorK4wumxrIT7HqltO8SJsZ5NzwX1SH1K_cAk1PlIqLmWTZsENxkfjX_dHnvPxO-xWT-mB8QyBDtC0VVBcm"><br></font></div><div><br></div></div></div></div><br></div><br><div class="gmail_quote gmail_quote_container"><div dir="ltr" class="gmail_attr">Il giorno mer 25 feb 2026 alle ore 10:38 Valerio Pruneri via Pixeurope-ga <<a href="mailto:pixeurope-ga@lists.icfo.es">pixeurope-ga@lists.icfo.es</a>> ha scritto:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"><div class="msg712845828354354257">





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<p class="MsoNormal"><span lang="EN-US">Dear All<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><b><span lang="EN-US">Contribution requested by March 4^th, 2026.<u></u><u></u></span></b></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">Today I am writing to collect inputs for the ChipsAct 2.<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">Here is some context: European Commission is requesting Pilot Lines to provide inputs on technologies to prioritize for the future. Those have been categorized into areas/topics as in the slide included at the end of
 this email. With all inputs received from each of them, Pilot Lines will prepare a single document.
<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">In order to prepare PIXEurope’s contribution, we need to collect from each of you, who are interested, information on technologies you believe are critical and plan or continue to work in your organization, starting from
 2029.<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">To make things simple, at this stage, I ask you – please - to send me and the people in copy, who are our Exploitation and Innovation, and Project Managers, a brief description of your activities classifying them in the
 relevant areas below.<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">E.g. ICFO plans to work on “New Computer Algorithms” that leverage photonics. More specifically, analog photonic computing combined with digital processors and memories to reduce the energy consumption of current digital
 GPUs. In the longer term the technology can also be exploited for quantum computation, either using a full photonic schemes or hybrid atom-photon architecture.
<u>And so on for each of the different area/topic box….<u></u><u></u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">We will then collect your inputs and map them to provide our Pilot Line technical contribution to the Commission.<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">If something is not clear, please reach me out, rather than writing messages that might create noise.<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">I would need your inputs <b>by next Wednesday March 4</b>.
<u>Please not later, otherwise I cannot make sure it is included in these first inputs.<u></u><u></u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><u></u> <u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">Thanks,<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US">Valerio<u></u><u></u></span></p>
<p class="MsoNormal"><span lang="EN-US"><img width="418" height="227" style="width: 4.3541in; height: 2.3611in;" id="m_712845828354354257Picture_x0020_1" src="cid:ii_19cb44f6d344cff311"></span><span lang="EN-US"><u></u><u></u></span></p>
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